may 2009 doc id 15671 rev 1 1/7 7 STPS30120DJF power schottky rectifier features very small conduction losses negligible switching losses extremely fast switching low forward voltage drop low thermal resistance high avalanche capability specified ecopack ? 2 compliant component description schottky rectifier suited for switch mode power supply and high frequency dc to dc converters. packaged in power qfn, this device is intended for use in low voltage, high frequency inverters, free-wheeling and polarity protection applications. table 1. device summary i f(av) 30 a v rrm 120 v t j (max) 150 c v f (max) 0.68 v a k a a a a a k k power qfn (6x5) www.st.com
characteristics STPS30120DJF 2/7 doc id 15671 rev 1 1 characteristics to evaluate the conduction losses use the following equation: p = 0.61 x i f(av) + 0.005 i f 2 (rms) table 2. absolute ratings (limiting values) symbol parameter value unit v rrm repetitive peak reverse voltage 120 v i f(rms) forward rms current 45 a i f(av) average forward current t c = 80 c, = 0.5 30 a i fsm surge non repetitive forward current t p = 10 ms sinusoidal 200 a p arm repetitive peak avalanche power t p = 1 s t j = 25 c 12500 w t stg storage temperature range -65 to + 175 c t j maximum operating junction temperature (1) 1. condition to avoid thermal runaway for a diode on its own heatsink 150 c table 3. thermal resistance symbol parameter value unit r th(j-c) junction to case 2.5 c/w table 4. static electrical characteristics symbol parameter test conditions min. typ. max. unit i r (1) 1. pulse test: tp = 380 s, < 2% reverse leakage current t j = 25 c v r = v rrm 35 a t j = 125 c 5.5 16 ma v f (1) forward voltage drop t j = 25 c i f = 15 a 0.84 v t j = 125 c 0.61 0.67 t j = 25 c i f = 30 a 0.92 t j = 125 c 0.68 0.75 d ptot dtj - -------------- 1 rth j a ? () ------------------------- - <
STPS30120DJF characteristics doc id 15671 rev 1 3/7 figure 1. average forward power dissipation versus average forward current figure 2. average forward current versus ambient temperature ( = 0.5) p f(av) (w) 0.0 5.0 10.0 15.0 20.0 25.0 30.0 0 5 10 15 20 25 30 35 40 =0.05 =0.1 =0.2 =0.5 =1 t =tp/t tp i f(av) (a) i f(av) (a) 0 5 10 15 20 25 30 35 0 25 50 75 100 125 150 r th(j-a) =r th(j-c) t =tp/t tp t amb (c) figure 3. normalized avalanche power derating versus pulse duration figure 4. normalized avalanche power derating versus junction temperature 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 t (s) p p(t) p (1s) arm p arm 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 150 t (c) j p p (25c) arm (tj) arm figure 5. non repetitive surge peak forward current versus overload duration (maximum values) figure 6. relative variation of thermal impedance, junction to case, versus pulse duration i m (a) 0 20 40 60 80 100 120 140 160 180 200 1.e-03 1.e-02 1.e-01 1.e+00 t c =25c t c =75c t c =125c i m t =0.5 t(s) z th(j-c) /r th(j-c) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-05 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 single pulse tp(s)
characteristics STPS30120DJF 4/7 doc id 15671 rev 1 figure 7. reverse leakage current versus reverse voltage applied (typical values) figure 8. junction capacitance versus reverse voltage applied (typical values) i r (ma) 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 0 102030405060708090100110120 t j =150c t j =125c t j =25c t j =100c t j =75c t j =50c v r (v) c(pf) 100 1000 10000 1 10 100 1000 f=1mhz v osc =30mv rms t j =25c v r (v) figure 9. forward voltage drop versus forward current figure 10. thermal resistance junction to ambient versus copper surface under tab i fm (a) 0 5 10 15 20 25 30 35 40 45 50 55 60 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 t j =25c (maximum values) t j =125c (maximum values) t j =125c (maximum values) t j =125c (typical values) t j =125c (typical values) v fm (v) 0 50 100 150 200 250 012345678910 r th(j-a) (c/w) power qfn 6x5 s cu (cm2) epoxy printed circuit board fr4, copper thickness = 35 m
STPS30120DJF package information doc id 15671 rev 1 5/7 2 package information epoxy meets ul94,v0 in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 11. footprint (in millimeters) table 5. package dimensions ref. dimensions millimeters inches min. max. min. max. a 4.95 5.05 0.195 0.199 b 5.95 6.05 0.234 0.238 c 4.58 4.68 0.180 0.184 d 4.37 4.47 0.172 0.176 d1 0.95 1.05 0.037 0.041 f chamfer 0.30 x 45 typ. chamfer 0.012 x 45 typ. g 1.68 typ. 0.066 typ. h 0.41 typ. 0.016 typ. j 0.59 0.63 0.022 0.026 k 0.86 typ. 0.034 typ. l 0.20 typ. 0.008 typ. m 0.41 typ. 0.016 typ. n 0.20 typ. 0.008 typ. p 0.25 typ. 0.01 typ. q 0.71 0.81 0.028 0.032 a b c q d e f g h j d1 k l m n p 4.47 4.88 0.712 0.86 1.68 0.86 both anode pads must be connected together.
ordering information STPS30120DJF 6/7 doc id 15671 rev 1 3 ordering information 4 revision history table 6. ordering information order code marking package weight base qty delivery mode stps30120cdjf-tr stps30120cdjf power qfn (6x5) ecopack ? 2 0.095 g 5000 tape and reel table 7. document revision history date revision changes 18-may-2009 1 first issue.
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